Important Dates
Conference: June 12-14, 2019
On Site Registration Time:
14:00-21:00 June 11th
8:00-17:30 June 12th
8:00-17:30 June 13th
8:00-15:00 June 14th
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Poster Size:
Height: 110-120 cm
Width: 90-100 cm
The poster should be prepared by the authors.
作者需自己准备海报,带至现场。
No special slide/poster format is required.
幻灯片和海报没有格式要求。
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Conference Location:
Hotel: Grand Park Xian
(西安君乐城堡酒店)
Address: 12 Xi Duan, Huan Cheng South Road, 710068, Xian, China.
Contact
- Lei Yuan
- Email: edssc2019@126.com
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Call For Paper
IEEE EDSSC 2019 is the 15th in a series of very successful conferences initiated by IEEE ED/SSC Hong Kong Joint Chapter. EDSSC 2019 continues the EDSSC tradition as a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the broad areas of electron devices and solid-state circuits and systems. The technical program includes invited talks by famous scientists and contributed papers. All accepted papers will be invited to submit to the IEEE Xplore database which will be indexed by EI Compendex.
We invite contributions describing the latest scientific and technological results in subjects including but not limited to the following:
· Silicon Devices | · Compound Semiconductor Devices |
· Modeling and Simulation | · Device and Circuit Reliability |
· Nanoelectronics | · Analog Circuits |
· Memory Devices and Tech. | · Digital Circuits |
· Photonic Devices | · Biomedical Circuits |
· RF & Microwave | · System and Package |
· Power Electronics | · Optoelectronic Materials and Devices |
· Organic Electronics | · Wireless Communication |
· Display and Imager | · Artificial Intelligence Circuit and System |
· MEMS and Sensors | · Renewable Energy Devices and Systems |
· Information System | · Algorithm |
Sponsors
西安理工大学推进“双一流”建设暨建校70周年纪念
EDSSC学术会议