Important Dates
Conference: June 12-14, 2019
On Site Registration Time:
14:00-21:00 June 11th
8:00-17:30 June 12th
8:00-17:30 June 13th
8:00-15:00 June 14th
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Poster Size：
Height: 110-120 cm
Width: 90-100 cm
The poster should be prepared by the authors.
作者需自己准备海报，带至现场。
No special slide/poster format is required.
幻灯片和海报没有格式要求。
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Conference Location：
Hotel: Grand Park Xian
（西安君乐城堡酒店）
Address: 12 Xi Duan, Huan Cheng South Road, 710068, Xian, China.
Contact
- Lei Yuan
- Email: edssc2019@126.com
| Invited Speaker | Affiliation | Research Area |
| Zhihua Wang | Tsinghua University, China | IC Design, Biomedical Circuits |
| Tianling Ren | Tsinghua University, China | 2D Electronics, Wearable Electronics, AI Devices |
| Joshua Yang | University of Massachusets, USA | Emerging Devices |
| Xinnan Lin | Peking University Shenzhen Graduate School, China | Device Modeling, GaN Devices |
| Zhangming Zhu | Xidian University, China | Analog/RF Circuits |
| Jincheng Zhang | Xidian University, China | Wide Bandgap Materials and Devices |
| Xiaoyang Zeng | Fudan University, China | IC Design |
| Mingbin Yu | Shanghai Institute of Microsystem & Information Tech., China | Silicon Photonics Integration |
| Xiaoqing Wen | Kyushu Institute of Technology, Japan | VLSI Design and Test |
| Kazuhide Ino | Rohm Co., Ltd., Japan | SiC Device |
| Teruo Suzuki | Socionext Inc., Japan | ESD Protection |
| Koji Kotani | Akita Prefectural University, Japan | IC Design |
| T. K. Chiang | National University of Kaohsiung, Taiwan, China | Nano Devices |
| Yang Chai | Hong Kong Polytechnic University, China | 2D Electronics |
| H. S. Koo | Minghsin University of Science and Technology, Taiwan, China | Optoelectronics Devices |
| Weifeng Sun | Southeast University, China | Power Electronics Devices |
| Jun Wang | Hunan University, China | Power Electronics Devices |
| Hongyu Yu | Southern University of Science and Technology, China | Memory, GaN HEMT |
| Shuyu Lei | ABAX Sensing, China | Sensors, IC Design |
| Changli Zhang | Shenzhen Huasemi Electronics Co. Ltd., China | Power Semiconductor Module |
| Chien-Jung Huang | National University of Kaohsiung, Taiwan, China | Optoelectronics |
| Fushan Li | Fuzhou University, China | Nano Devices and Materials |
| Yan Lu | University of Macau, China | Analog IC Design |
| Xiaobing Yan | Hebei Univerisity, China | Memristor |
| Li Geng | Xi'an Jiaotong University, China | IC Design |
| Hongxia Liu | Xidian University, China | Microelectronics Reliability |
| Yinshui Xia | Ningbo University, China | IC Design |
| Xiaozong Huang | China Electronics Technology Group Corporation | ESD Protection |
| Rongsheng Chen | South China University of Technology, China | Thin Film Transistor |
| Changjian Zhou | South China University of Technology, China | Acoustic Wave Devices, 2D Materials |
| Nan Chen | Northwestern Polytechnical University, China | IC Design |
| Nan Qi | Institute of Semiconductor, CAS, China | Optical Interconnects |
| Min Zhang | Peking University Shenzhen Graduate School, China | Flexible Electronics |
| Sang Lam | Xi'an Jiaotong-Liverpool University, China | Semiconductor Devices |
| Yuan Wang | Peking University | ESD Protection |
| Yan Yang | Institute of Microelectronics, CAS, China | Electro-Photonics Integration |